Reference

Payment Certification Levels

A practical guide to EMVCo L1 / L2 / L3 terminal certifications, PCI DSS merchant compliance tiers, and the standards that govern every card-present transaction.

EMV Chip Structure & Scheme Specifications

Physical chip architecture, logical file system, memory map, and a side-by-side comparison of how Visa, Mastercard, Amex, Discover, JCB, and UnionPay implement and extend the EMV specification — AID, kernel, ODA, CVM, CVN, and script differences in one view.

Physical Chip Architecture

ISO 7816 Contact Module
C1VCC
C5GND
C2RST
C6VPP†
C3CLK
C7I/O
C4RFU
C8RFU

† VPP deprecated ISO 7816-3:1997

Secure Element IC
CPU Core8 / 16 / 32-bit RISC
ROMOS + App code (~256 KB)
EEPROM / FlashKeys + Data (~128 KB, persistent)
RAMWorking memory (~8 KB, volatile)
Crypto Engine3DES · AES · RSA · ECC · RNG
Contact I/FISO 7816 T=0 / T=1
RF InterfaceISO 14443 (dual-interface only)
RF

Embedded copper coil
13.56 MHz · ISO 14443
Dual-interface only

ROM~256 KB · read-only after manufacturing
  • Card OS — Java Card JCOP, Multos, or native proprietary
  • EMV application bytecode / native compiled code
  • Cryptographic subroutine library (DES, AES, RSA, hash)
  • Communication protocol handlers — T=0, T=1, ISO 14443
EEPROM / Flash~64–256 KB · persistent across power-off
  • PAN (5A), Expiry (5F24), CVV seed, Track 2 Equivalent (57)
  • UDK-AC, UDK-SMI, UDK-SMC — symmetric personalization keys
  • ICC RSA private key + ICC Public Key Certificate (9F46)
  • Issuer Public Key Certificate (90), CA PK reference (8F)
  • CVM List (8E), CDOL1/2, AIP (82), Application counters
  • ATC (9F36), PIN try counter, offline floor limits, AUC (9F07)
  • IAD template, risk management parameters, script counters
RAM~4–16 KB · cleared on every power-off
  • Session keys SK-AC / SK-SMI / SK-SMC — never stored permanently
  • APDU command and response working buffer
  • Cryptographic intermediate values — hash state, RSA exponentiation scratch
  • Transaction working data — TVR build, ODA scratch, CDOL data

EMV Logical File System

ISO 7816-4 hierarchical file system. Each payment application lives in its own ADF, identified by its AID. Multiple AIDs (Visa + Mastercard, or credit + debit) can coexist on one chip.

🗂️MF — Master FileRoot of the ISO 7816 card file system
📁PSE — 1PAY.SYS.DDF01Contact Payment System Environment — directory of available payment AIDs with priority
📄EF.DIR (SFI 1)Records list ADF entries: AID (4F) · App label (50) · App priority indicator (87)
📡PPSE — 2PAY.SYS.DDF01Contactless Payment System Environment — AID list returned inline in SELECT FCI, no separate EF
📄FCI (tag 6F → A5 → BF0C)AID list embedded in response: BF0C → 61 entries each with 4F (AID), 50 (label), 87 (priority), 9F2A (kernel ID)
💳ADF — A0 00 00 00 03 10 10 (Visa Credit)Application Dedicated File — one per payment AID. Terminal SELECTs by AID, receives FCI with PDOL.
📄EF.FCI (SELECT AID response, tag 6F)App label (50) · PDOL (9F38) · Language pref (5F2D) · App preferred name (9F12) · Issuer code table (9F11)
📄EF.APPL Records (per AFL 94 entries)Rec 1: PAN (5A) · Expiry (5F24) · Track 2 (57) · Cardholder name (5F20) — Rec 2: CVM List (8E) · CDOL1 (8F4D) · CDOL2 (8F4E) · AIP (82) · AFL (94) — Rec 3: Issuer PK Cert (90) · ICC PK Cert (9F46) · Issuer PK exponent (9F32) · ICC PK exponent (9F47)
🔒EF.ICC — internal, not readable over APDUICC Private Key · UDK-AC / UDK-SMI / UDK-SMC · ATC counter · PIN reference value · offline counters · script sequence counter

Chip Interface Categories

💳
Contact-Only
ISO 7816 · T=0 / T=1
  • 6 active contacts (C1–C3, C5–C7); C4 and C8 as RFU
  • Full EMV transaction including second GENERATE AC
  • ATM cards, older credit cards pre-2015
  • Lower chip cost, no RF antenna in card body
📱
Mobile SE / HCE
eSE · UICC · Cloud token
  • eSE — embedded SE in phone motherboard (Apple Pay, Google Pay hardware path)
  • UICC — SIM card hosts payment applet (carrier wallets)
  • HCE — NFC handled by Android OS, keys in cloud tokenization vault, no physical SE
  • CDCVM (biometric / device PIN) replaces card CVM
Wearable / Token
NFC-only · embedded SE or tokenized
  • Smartwatches, rings, wristbands, payment stickers
  • Uses tokenized PAN (DPAN) — Visa VTS, MC MDES
  • No PIN pad — low-CVM or CDCVM on paired phone
  • Same EMV contactless kernel as phone wallet (K2–K3)

EMV Specification Books

Contact (EMVCo Books 1–4)
Book 1
ICC to Terminal Interface
Physical layer, T=0 / T=1 protocols, ATR / ATS, logical channel APDU transport, card activation and deactivation sequence
Book 2
Security & Key Management
SDA / DDA / CDA offline data authentication, RSA key recovery, PIN processing, application cryptogram generation, session key derivation (CVN)
Book 3
Application Specification
Transaction flow commands (SELECT, GPO, READ RECORD, GENERATE AC), CVM processing, terminal and card action analysis, issuer script execution
Book 4
Cardholder & Terminal Interface
PIN entry UX, receipt format, error message display, attendant prompts, terminal capability requirements for L3 acquirer integration
Contactless (EMVCo Books A–E)
Book A
Architecture & General
System architecture, entry point, kernel selection, PPSE flow, protocol management
Book B
Entry Point
Terminal entry point, pre-processing, field detection, outcome reporting, restart/retry, kernel activation routing
Book C
Kernel Specs (K1–K6)
K1 Interac, K2 Mastercard, K3 Visa, K4 Amex, K5 JCB, K6 Discover/UnionPay — TTQ, CTQ, CDOL, fDDA flows per kernel
Book D
Device Specification
RF interface requirements, ISO 14443 electrical compliance, analog signal specs, PCD antenna test criteria
Book E
Proprietary Kernel Guidelines
Guidelines for kernels beyond K1–K6, entry point compatibility rules, interoperability requirements for scheme-proprietary kernels

Payment Scheme EMV Implementation Comparison

How each major scheme implements and extends the core EMV specification.

Filter:
FeatureVisaMastercardAmexDiscoverJCBUnionPay
Contact Chip
Contact specificationVisa EMV v1.4 (VIS)M/Chip Advance · M/Chip SelectAEIPS v2.xD-PASJ/Smart v3.xPBOC 3.0 / EMV hybrid
AID — CreditA0 00 00 00 03 10 10A0 00 00 00 04 10 10A0 00 00 00 25 01 04 02A0 00 00 01 52 30 10A0 00 00 00 65 10 10A0 00 00 03 33 01 01 01
AID — Debit / NationalA0 00 00 00 03 20 20 (V PAY)A0 00 00 00 04 30 60 (Maestro)A0 00 00 00 25 01 07 01A0 00 00 01 52 40 10— (credit only)A0 00 00 03 33 01 01 02
ODA — contactSDA · DDA · CDA (CDA preferred)DDA required (M/Chip Advance); SDA legacy onlyDDA requiredDDA · SDA (legacy)DDA · CDADDA · SDA
CVN versionsCVN10 · CVN18M/Chip CVN 0x10 · 0x18AEIPS CVN 1 · 3 · 5D-PAS CVNJ/Smart methodPBOC 3DES · SM4
AC algorithm3DES (session key MAC)3DES (session key MAC)3DES3DES3DES3DES · SM4 (domestic China)
ARPC methodMethod 1 (ARQC XOR RC) · Method 2Method 1 · Method 2Method 2 (AEIPS-specific)Method 1 · 2Method 1PBOC method
CVM — contactOffline Enc PIN · Online PIN · Signature · No CVMOffline Enc PIN · Online PIN · Signature · No CVMOnline PIN · Signature · No CVMOffline PIN · Online PIN · SignatureOffline PIN · Online PIN · SignatureOnline PIN · Offline PIN · No CVM
Script processingYes — tags 71 / 72 (SMI + SMC)Yes — tags 71 / 72YesYesYesYes (PBOC scripts)
Contactless
Contactless specVisa payWave / Visa ContactlessMastercard PayPass / Tap & GoExpressPay 3.xDiscover Zip / D-PAS CLJ/SpeedyQuickPass (qPBOC)
EMV CL KernelKernel 3 (K3)Kernel 2 (K2)Kernel 4 (K4)Kernel 6 (K6)Kernel 5 (K5)Kernel 6 (UP) / Proprietary
ODA — contactlessfDDA (combined in GENERATE AC)fDDA / CDAODA optional (K4)fDDAfDDA / CDAqSDA (PBOC style)
TTQ / CTQ negotiationTTQ (9F66) in PDOL — no CTQ from cardTTQ (9F66) · CTQ (9F6C) card responseTerminal Capabilities (9F33)TTQ (9F66)TTQ (9F66)QPBOC-specific fields
CL mag-stripe modeYes — qVSDCYes — PayPass mag-stripeNo — EMV mode onlyYes — D-PAS mag modeNoNo — qPBOC EMV only
CL CVM above limitOnline PIN · CDCVM (mobile)Online PIN · CDCVMOnline PIN · SignatureOnline PIN · SignatureOnline PIN · SignatureOnline PIN
Second GENERATE ACOptional — skipped in typical NFC tapOptionalNot in standard flowOptionalOptionalTypically skipped
Digital & Tokenization
Tokenization serviceVisa Token Service (VTS)MDESAmex Token ServiceDiscover Token ServiceJCB TokenizationUnionPay Token Service
3DS brandVisa Secure (3DS 2.x)Identity Check (3DS 2.x)SafeKey 2.xProtectBuyJ/Secure 2.xSecurePlus
Processing networkVisaNetBanknetAmexNetDiscover / PULSEJCB / CAFISCUP / UnionPay International

EMV L2 Contactless Kernel Reference

K1
Interac
Interac Flash (Canada)

Domestic Canadian debit. Contactless debit transactions under CAD $250. Interac AID A0 00 00 02 77 10 00. Defined in EMVCo Book C-1.

K2
Mastercard
PayPass · Tap & Go · M/Chip CL

Most widely deployed kernel. Full TTQ + CTQ capability negotiation. Supports both EMV mode and mag-stripe mode. Book C-2.

K3
Visa
payWave · Visa Contactless

TTQ in PDOL. Supports qVSDC mag-stripe fallback, EMV Mode, and fDDA. No CTQ from card — terminal-driven negotiation. Book C-3.

K4
American Express
ExpressPay 3.x

EMV mode only — no mag-stripe mode. Uses terminal capabilities (9F33) rather than TTQ for negotiation. Book C-4.

K5
JCB
J/Speedy

Deployed primarily in Japan and JCB-issuing markets. Shares TTQ negotiation model with Visa. EMV mode only. Book C-5.

K6
Discover / UnionPay
Discover Zip · QuickPass (qPBOC)

Shared kernel slot. Discover uses D-PAS contactless profile; UnionPay uses qPBOC with SM4 option for domestic China transactions. Book C-6.

Related Tools

Use these tools to work with the cryptographic primitives that underpin terminal and card security.